Compact Auger Analysers microCMA

Simple to operate and easy to maintain, the microCMA provides a complete quantitative surface sensitive elemental Auger Electron (AES) analyser package that mounts on a 2.75”/ 70 mm CF flange. For elemental analysis, the microCMA is more affordable than a standalone XPS system. The complete AES system includes the cylindrical mirror analyser (with integrated coaxial electron gun), a USB interface controller, and Windows acquisition and data-massage software. It's Auger analysis made easy!

Key features

  • Fits on a 2.75” (70 mm) CF flange
  • Built-in co-axial 3 kV electron gun
  • Customisable length
  • Can be baked up to 250° C
  • Easy to use
Base package: microCMA analyzer, USB interface controller, preamp with 15 ft (4.6m) cable, data acquisition and massage software, and manual. Optional accessories: XYZ translator, 9103 USB picoammeter, custom lengths for CMA and preamp cable. See a demonstration, this video shows how easy it is to set up and control the microCMA with RBD Instruments software, along with a short history of Auger surface systems, check out the video here.

What's Special about the microCMA?
The microCMA is the best little AES cylindrical mirror analyser. By utilising the cylindrical mirror design, the microCMA has the same sensitivity and energy resolution as much larger and more expensive Auger Electron spectrometers. A CMA accepts electrons at a 42.3° angle (which is the angle where second-order focusing is possible). The CMA Entrance Angle drawing (see in images) shows that both the 2.75" flange microCMA and the 10.0" 25-120A CMA (used on the PHI 660 system) accept electrons at the 42.3° angle. Since the microCMA has a smaller diameter than the 25-120A, the end of optics-to-sample distance is shorter. But the same electrons are collected whether using the microCMA or the 25-120A.

Theory and Applications
The microCMA is an Auger Spectroscopy cylindrical mirror analyser designed for the many applications for Auger analysis that do not require AES mapping capability. Those applications include analysis of:
  • Thin film elemental composition.
  • Sample cleanliness.
  • Metal component thermal oxides.
  • Quantization of light element surface films.
  • Surface contamination analysis.
Download Application notes here:  Application 1, Application 2.

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